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King Yuan Electronics Co., Ltd.
2449
As of 24 April 2025, King Yuan Electronics Co., Ltd. has a market cap of $3.13B USD, ranking #3990 globally and #86 in Taiwan. It ranks #550 in the Technology sector, and #79 in the Semiconductors industry.
Key Stats
Market Cap
$3.13BUSD
101.73B TWD
Enterprise Value
$3.52BUSD
114.47B TWD
Revenue (TTM)
$825.83MUSD
26.86B TWD
EBITDA (TTM)
$413.04MUSD
13.44B TWD
Net Income (TTM)
$239.22MUSD
7.78B TWD
Company Profile
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Markets
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2449
京元電子股份有限公司
ISIN: TW0002449006
Shares Out.:
Shares Outstanding:
1.223B1
Shares Float:
1.119B2
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82.00 TWD
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1Market cap is calculated using shares outstanding.
2Float shares are publicly tradable shares, excluding insider-held stock.
About King Yuan Electronics Co., Ltd.
King Yuan Electronics Co., Ltd. engages in the designing, manufacturing, selling, testing, and assembly service of integrated circuits in Taiwan, Asia, North America, and internationally. It offers memory IC test solutions for memory products, such as NOR and NAND flash memory, Mask-ROM, EPROM, EEPROM, DRAM, SDRAM, RDRAM, DDR I and DDR II, SRAM, Pseudo SRAM, and embedded memory products; and consumer electronics testing solutions for games, digital audio, digital TV, set-top box, and others. The company also provides logic and mixed-signal IC test solutions for audio/video, ODD IC's, chipset, xDSL, MB/GB Ethernet, MAC, PHY, BB, MCU, AC/DC converter, embedded controllers, LVDS, USB, firewire, etc.; and liquid crystal display (LCD) driver test solutions for use in high pixel count LCD panels comprising super extended graphics array and ultra-extended graphics array. In addition, it offers CMOS mage, DPS/EMBED DRAM image, charge-coupled device image, high resolution and high speed image, and integration SOC image sensors for cameras, various mobile phones, digital cameras, and digital video recorders; and radio frequency IC test solutions, as well as cellular phone type applications. Further, the company provides system on chip (SOC) test solutions, such as testing, diagnosis, verification, characterization, and debugging services for SOC devices comprising ASIC and ASSP; solutions to test various kinds of multi-mode MEMS devices comprising microphones, gyroscope, acceleration sensor, electronic compass, and pressure sensors; and biochip testing solutions. Additionally, it offers ball grid array, QFN/DFN/WSON, thin small outline, land grid array, eMMC/eMCP/MCP, and memory card package services. The company also manufactures and sells IC burn-in systems and wafer level burn-in systems; manufactures and wholesales electronics parts and components; and offers electronics repairing services. The company was incorporated in 1987 and is headquartered in Hsinchu City, Taiwan.
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