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As of 24 April 2025, Tazmo Co., Ltd. has a market cap of $168.58M USD, ranking #18173 globally and #1775 in Japan. It ranks #2561 in the Technology sector, and #476 in the Electronic Components industry.
Key Stats
Market Cap
$168.58MUSD
24.02B JPY
Enterprise Value
$160.42MUSD
22.96B JPY
Revenue (TTM)
$251.7MUSD
35.87B JPY
EBITDA (TTM)
$47.78MUSD
6.84B JPY
Net Income (TTM)
$29.81MUSD
4.25B JPY
EBITDA Margin
19%
Profit Margin
12%
PE Ratio
5.7
Company Profile
Country (HQ)
Sector
Technology
Industry
Electronic Components
CEO
Yasuyuki Sato
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Employees
1,163
Founded
1972
Website
tazmo.co.jp
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warningChart data may be delayed
| 1d | 1w | 1m | 3m | 6m | 1y |
|---|---|---|---|---|---|
| 2% | 3.9% | -21% | -23% | -53% | -54% |
Upcoming Earnings
Earnings Date
Wed, May 14
Markets
| Exchange | Ticker | Price |
|---|---|---|
|
6266
タツモ株式会社
ISIN: JP3468000009
Shares Out.:
Shares Outstanding:
14.658M1
Shares Float:
10.28M2
|
1.66K JPY | |
|
TZMOF
タツモ株式会社
ISIN: JP3468000009
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0.0000 USD |
1Market cap is calculated using shares outstanding.
2Float shares are publicly tradable shares, excluding insider-held stock.
About Tazmo Co., Ltd.
Tazmo Co., Ltd. manufactures and sells semiconductor manufacturing equipment in Japan, Taiwan, China, South Korea, Vietnam, rest of Asia, North America, and Europe. The company operates through three segments: Process Equipment Business, Mold/Resin Molding Business, and Surface Treatment Equipment Business. It provides semiconductor manufacturing equipment comprising bonder/debonders, cleaning systems, CMP slurry distribution systems, coater/developers, and phosphoric acid reclamation process equipment; clean transfer equipment, including atmospheric and vacuum robots, and pre aligners; nanoimprint fully automated mass production equipment; FPD manufacturing equipment, such as FDP/PLP coaters and manual coaters; precision molding dies and plastic moldings comprising mold and injection molding, emboss carrier tapes, and precision parts; and UV irradiation systems. The company offers LCD manufacturing equipment; UV laser equipment plating equipment, mold resin molding, and plating/circuit formation equipment for PCB. The company was incorporated in 1972 and is headquartered in Okayama, Japan.
