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Japan Pure Chemical Co.,Ltd.

4973
TSE: 4973 Delayed
5,120JPY 2%
31.96 USD
As of 15 June 2026, Japan Pure Chemical Co.,Ltd. has a market cap of $181.3M USD, ranking #21696 globally and #1781 in Japan. It ranks #2306 in the Basic Materials sector, and #731 in the Specialty Chemicals industry.
Global Rank
21696
Country Rank
1781
Sector Rank
2306
Industry Rank
731
Key Stats
Market Cap
$181.3MUSD
29.05B JPY
Enterprise Value
$132.91MUSD
21.3B JPY
Revenue (TTM)
$112.8MUSD
18.07B JPY
EBITDA (TTM)
$4.15MUSD
665.0M JPY
Net Income (TTM)
$11.25MUSD
1.8B JPY
EBITDA Margin
3.7%
Profit Margin
10%
PE Ratio
16.2
PS Ratio
1.6
PB Ratio
1.6
EV/EBITDA
32.0
Company Profile
Country (HQ)
Sector
Basic Materials
Industry
Specialty Chemicals
CEO
Tomoyuki Kojima open_in_new
Employees
52
Founded
1971
Website
netjpc.com open_in_new
warningChart data may be delayed
1d 1w 1m 3m 6m 1y
2% 1% 1.7% 3.3% 53% 71%

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Markets

Exchange Ticker Price
Tokyo Stock Exchange
MIC: XTKS
PRIMARY
4973
日本高純度化学株式会社
ISIN: JP3706600008
Shares Out.:
5.803M1 Shares Float: 4.567M2
TV:
SA:
YF:
GF:
BA:
MS:
5,120 JPY
1Market cap is calculated using shares outstanding.
2Float shares are publicly tradable shares, excluding insider-held stock.

About Japan Pure Chemical Co.,Ltd.

Japan Pure Chemical Co.,Ltd. develops, manufactures, and sells precious metal plating chemicals for electronic components in Japan and internationally. The company provides gold electrolytic plating formulation for semiconductor applications, as well as PWB, connector, contact, and soldering applications; strike gold plating formulation for lead frame applications; flash gold plating formulation for leadframe uses; and palladium electrolytic formulation for connector and lead frame uses. It also offers gold plating formulation for soldering and wire bonding; electroless palladium plating formulation for wire bonding and soldering uses; and electrolytic and electroless silver plating formulations. In addition, the company provides anti bacterial agents for plating tanks and drag-out tanks; and impurity removal resin that removes Cu ions dissolved in Au and palladium plating formulation. Additionally, it offers surface treatment chemicals and stripping agents. Japan Pure Chemical Co.,Ltd. was founded in 1971 and is based in Tokyo, Japan.

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