Global /Japan /Basic Materials /Specialty Chemicals /4966
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C.Uyemura & Co.,Ltd. logo

C.Uyemura & Co.,Ltd.

4966
TSE: 4966 Delayed
23,440JPY 0.5%
146.17 USD
As of 12 June 2026, C.Uyemura & Co.,Ltd. has a market cap of $2.35B USD, ranking #6356 globally and #439 in Japan. It ranks #619 in the Basic Materials sector, and #175 in the Specialty Chemicals industry.
Global Rank
6356
Country Rank
439
Sector Rank
619
Industry Rank
175
Key Stats
Market Cap
$2.35BUSD
376.33B JPY
Enterprise Value
$2.03BUSD
325.23B JPY
Revenue (TTM)
$540.27MUSD
86.49B JPY
EBITDA (TTM)
$139.28MUSD
22.33B JPY
Net Income (TTM)
$90.64MUSD
14.51B JPY
EBITDA Margin
26%
Profit Margin
17%
PE Ratio
25.9
Forward PE
23.9
PS Ratio
4.4
PB Ratio
3.3
EV/EBITDA
14.6
Company Profile
Country (HQ)
Sector
Basic Materials
Industry
Specialty Chemicals
CEO
Hiroya Uemura open_in_new
Employees
1,552
Founded
1848
Website
uyemura.co.jp open_in_new
warningChart data may be delayed
1d 1w 1m 3m 6m 1y
0.5% 1.3% 6.5% 32% 87% 158%

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Markets

Exchange Ticker Price
Tokyo Stock Exchange
MIC: XTKS
PRIMARY
4966
上村工業株式会社
ISIN: JP3155350006
Shares Out.:
16.088M1 Shares Float: 7.972M2
TV:
SA:
YF:
GF:
BA:
MS:
23,440 JPY
1Market cap is calculated using shares outstanding.
2Float shares are publicly tradable shares, excluding insider-held stock.

About C.Uyemura & Co.,Ltd.

C.Uyemura & Co.,Ltd., together with its subsidiaries, engages in the research, development, manufacture, and sale of surface treatment chemicals and machinery in Japan, Taiwan, China, and internationally. It operates through Surface Finishing Materials Business, Surface Finishing Machinery Business, Plating Job Business, Real Estate Rental Business, and Other segments. The company offers plating chemicals and machines for printed wiring boards and aluminum magnetic disks, industrial chemicals, and non-ferrous metals. It also provides electronic circuit boards, including package boards, rigid and flexible printed wiring boards, plating equipment, and plating solution control systems; semiconductors, such as logic and memory devices; electric components comprising connectors, passive devices, and power devices; and functional plating, which includes pre-treatment, composite and nickel plating, and plating solution control systems. In addition, the company offers copper plating, final finish, electroless plating, and hard disk media Ni-P plating processes, as well as electrolytic plating process for bump formation; chemical pre and post treatment, and stripper, as well as chromium, zinc, tin and tin alloy, gold, silver, and palladium plating; polishing compounds solutions, such as solid and liquid buffing, and barrell, as well as polishing equipment; and surface finishing systems. Further, it is involved in the leasing of office buildings, apartment houses, and factory land. C.Uyemura & Co.,Ltd. was founded in 1848 and is headquartered in Osaka, Japan.

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