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China Chippacking Technology Co.,Ltd. logo

China Chippacking Technology Co.,Ltd.

688216
SSE: 688216 Delayed
30.64CNY 6.4%
4.53 USD
As of 14 June 2026, China Chippacking Technology Co.,Ltd. has a market cap of $484.02M USD, ranking #15348 globally and #4797 in China. It ranks #2307 in the Technology sector, and #409 in the Semiconductors industry.
Global Rank
15348
Country Rank
4797
Sector Rank
2307
Industry Rank
409
Key Stats
Market Cap
$484.02MUSD
3.28B CNY
Enterprise Value
$548.53MUSD
3.71B CNY
Revenue (TTM)
$127.01MUSD
860.62M CNY
EBITDA (TTM)
$19.72MUSD
133.47M CNY
Net Income (TTM)
-$6.93MUSD
-46.94M CNY
EBITDA Margin
16%
Profit Margin
-5.5%
PS Ratio
3.8
PB Ratio
4.3
EV/EBITDA
27.4
Company Profile
Country (HQ)
Sector
Technology
Industry
Semiconductors
CEO
Dazhong Liang open_in_new
Employees
1,802
Founded
2006
Website
chippacking.com open_in_new
warningChart data may be delayed
1d 1w 1m 3m 6m 1y
6.4% -1.6% 5.7% -15% 13% 67%

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Markets

Exchange Ticker Price
Shanghai Stock Exchange
MIC: XSHG
PRIMARY
688216
气派科技股份有限公司 Class A
ISIN: CNE100005113
Shares Out.:
114.78M1 Shares Float: 114.767M2
TV:
SA:
YF:
GF:
BA:
MS:
30.64 CNY
1Market cap is calculated using shares outstanding.
2Float shares are publicly tradable shares, excluding insider-held stock.

About China Chippacking Technology Co.,Ltd.

China Chippacking Technology Co.,Ltd. provides integrated circuit packaging and testing services in China and internationally. The company offers CPC, ECPC, DFN, QFN, LQFP, MSOP, DIP, QIPAI, EMSOP, SOP, tODAY, SSOP, HSOP, TO, TSSOP, ESOP, and TSOT, as well as MEMS,FC, 5G nitride automotive, home RF devices in plastic packages, such as QFN/DFN, CQFN/CDFN, SOT, DIP, and PDFN packaging forms. Its products are used in consumer electronics, information and communication, smart home, IoT, industrial automation control, and automotive electronics applications. The company also provides power device packaging and testing, and wafer testing services. The company was founded in 2006 and is based in Dongguan, China.

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