Global /China /Technology /Electronic Components /301366
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Shenzhen Edadoc Technology Co.,Ltd. logo

Shenzhen Edadoc Technology Co.,Ltd.

301366
SHE: 301366 Delayed
38.35CNY 0.3%
5.67 USD
As of 15 June 2026, Shenzhen Edadoc Technology Co.,Ltd. has a market cap of $1.18B USD, ranking #9781 globally and #2674 in China. It ranks #1467 in the Technology sector, and #133 in the Electronic Components industry.
Global Rank
9781
Country Rank
2674
Sector Rank
1467
Industry Rank
133
Key Stats
Market Cap
$1.18BUSD
7.99B CNY
Enterprise Value
$1.11BUSD
7.51B CNY
Revenue (TTM)
$176.43MUSD
1.19B CNY
EBITDA (TTM)
$20.61MUSD
139.5M CNY
Net Income (TTM)
$7.02MUSD
47.5M CNY
EBITDA Margin
12%
Profit Margin
4%
PE Ratio
167.9
PS Ratio
6.7
PB Ratio
3.7
EV/EBITDA
50.2
Company Profile
Country (HQ)
Sector
Technology
Industry
Electronic Components
CEO
Changmao Tang open_in_new
Employees
2,725
Founded
2003
Website
edadoc.com open_in_new
warningChart data may be delayed
1d 1w 1m 3m 6m 1y
0.3% 0.8% 24% 2.9% -0.8% 20%

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Markets

Exchange Ticker Price
Shenzhen Stock Exchange
MIC: XSHE
PRIMARY
301366
深圳市一博科技股份有限公司 Class A
ISIN: CNE100005LG8
Shares Out.:
74.666M1 Shares Float: 28.869M2
TV:
SA:
YF:
GF:
BA:
MS:
38.35 CNY
1Market cap is calculated using shares outstanding.
2Float shares are publicly tradable shares, excluding insider-held stock.

About Shenzhen Edadoc Technology Co.,Ltd.

Shenzhen Edadoc Technology Co.,Ltd. provides printed circuit board (PCB) design and PCB assembly manufacturing services in China and internationally. The company also offers simulation analysis services, such as DDRx simulation, high speed serial interface, power integrity simulation, SiP design, universal standard fixtures, and customized test fixtures; PCB board making; SMT welding products, including server and communication terminal equipment motherboard, signal processing boards, and industrial control and handheld device motherboards; and component selection products. Shenzhen Edadoc Technology Co.,Ltd. was founded in 2003 and is headquartered in Shenzhen, China.

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