Global /United States /Industrials /Specialty Industrial Machinery /KLIC
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Kulicke and Soffa Industries, Inc. logo

Kulicke and Soffa Industries, Inc.

KLIC
NASDAQ: KLIC Delayed
83.70USD 0.9%
As of 6 June 2026, Kulicke and Soffa Industries, Inc. has a market cap of $4.38B USD, ranking #4191 globally and #1197 in the United States. It ranks #837 in the Industrials sector, and #134 in the Specialty Industrial Machinery industry.
Global Rank
4191
Country Rank
1197
Sector Rank
837
Industry Rank
134
Key Stats
Market Cap
$4.38BUSD
Enterprise Value
$3.93BUSD
Revenue (TTM)
$687.58MUSD
EBITDA (TTM)
$34.2MUSD
Net Income (TTM)
-$64.63MUSD
EBITDA Margin
5%
Profit Margin
-9.4%
Forward PE
28.6
PS Ratio
6.4
PB Ratio
5.3
EV/EBITDA
115.0
Company Profile
Country (HQ)
Sector
Industrials
Industry
Specialty Industrial Machinery
CEO
Lester A. Wong open_in_new
Employees
2,551
Founded
1951
Website
kns.com open_in_new
warningChart data may be delayed
1d 1w 1m 3m 6m 1y
0.9% -1.4% 28% 42% 102% 156%

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Markets

Exchange Ticker Price
NASDAQ
MIC: XNAS
PRIMARY
KLIC
Kulicke & Soffa Industries Inc
ISIN: US5012421013
Shares Out.:
52.333M1 Shares Float: 50.525M2
TV:
SA:
YF:
GF:
NQ:
BA:
MS:
83.70 USD
Frankfurt Stock Exchange
MIC: XFRA
KU1
Kulicke & Soffa Industries Inc
ISIN: US5012421013
TV:
SA:
YF:
GF:
BA:
KU1
MS:
71.00 EUR
1Market cap is calculated using shares outstanding.
2Float shares are publicly tradable shares, excluding insider-held stock.

About Kulicke and Soffa Industries, Inc.

Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and consumables in China, the United States, Taiwan, Malaysia, Japan, the Philippines, Korea, Hong Kong, and internationally. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company provides services used to assemble semiconductor devices, such as integrated circuits, power discretes, light-emitting diode (LEDs), and sensors. It also offers ball bonding equipment, wafer level bonding equipment, and wedge and wedge-related bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares, and services for equipment. In addition, the company services, maintains, repairs, and upgrades equipment; and sells consumable aftermarket solutions and services. It serves integrated device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Singapore.

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